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Analyzing magnetic film performance is critical to the design and
production of Magnetic Recording Heads and Magnetic RAM devices.
The WLA-3000 Automated Wafer Level Analyzer can be integrated with a variety
of industry standard Automated Wafer Probers to characterize magnetic
properties of finished devices, test structures, and bulk thin films.
With the ISI High Field Quad-Pole Magnet, the WLA-3000 can apply
user-defined field vector while sampling DC and High Frequency MR Response
at each test site. The system can quickly measure DC Resistance while
applying a range of Magnetic Fields, Bias Levels, and Precisely-timed Bias
Pulses.
In magnetic heads production environment, the WLA-3000 offers high
throughput device performance verification as well as feedback to Wafer
Process control. Various options like Magnet, Probe Card, Relative
Inductance, Ferromagnetic Resonance and Hot Chuck allow customers to custom
configure the system for their specific needs.
For Magnetic RAM application, WLA-3000 offers these specific STT-RAM tests:
- I-V and R-V Curves
- Breakdown Voltage
- Transfer Curve
- Switching Currents vs. Pulse Widths
- Endurance Testing
- Switching Probability vs. Applied Current
- Low/High State R-V Distribution
- Error Rate TestingKey Benefits
Features:
- High Field Strength Dual Axis Magnet
- High Performance Electronics
- Programmable diode clamping levels
- Support Industry Standard Automated Probers
- Contacts grounded during probing
- Four point resistance measurement
- Simple Probe Card Alignment
- Optional Hot Chuck support
- Optional RIA-2008 support
- Optional FMRA-2008 support
- Comprehensive MR Analysis using QST-2002E Measurement System
- Open architecture software allowing custom module design using VB or
VC++
- Direct data output to various popular formats, including Microsoft
Excel™,
Access™, and CSV
- Engineering/production modes
- Intuitive user interface
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